Electronic Materials

National Starch manufactures, markets and sells a range of high-spec electronic and engineering materials, particularly adhesives, encapsulants and specialty coatings used in the assembly of semiconductor packages and the production of electronic, automotive, medical and aerospace devices. 

Within the Electronic Materials Division, Ablestik supplies adhesives and encapsulants used for semiconductor packaging and microelectronic assembly.  Products include adhesive pastes, printable paste and films, and underfill encapsulants.  Emerson & Cuming supplies adhesives, encapsulants, and coatings used in circuit assembly and in fabrication of electronic, electrical and electromechanical components.  Acheson supplies process lubricants and application systems used in metalworking and casting.

Printable adhesives: generations ahead

A new range of printable paste adhesives made and marketed by Ablestik Laboratories is replacing film adhesives in the assembly of the latest generation of computer memory devices. Ablestik is part of National Starch, a business of ICI.

‘Ableflex’ 6200 helps customers to reduce assembly costs by 20-30 per cent and provides a higher level of package reliability than film adhesives. The range, introduced to the market in 2005, has achieved the highest reliability rating in the memory chip packaging industry, and four major manufacturers (representing 80 per cent of the market) have approved its use.

Ablestik developed ‘Ableflex’ 6200 as an innovative new chemistry platform to address key customer needs, delivering value to the customer through a lower total cost of ownership.

In addition, this novel range of adhesives has led to a series of products that offer advantages in ‘manufacturability’ and performance. ‘Ablestik’ 6200 adhesives have been qualified by every DRAM (dynamic random access memory) manufacturer globally. 

The ‘Ableflex’ technology platform is being extended to include processing options such as UV B-staging and skip curability, both for improved throughput.




Sounds good

The world’s most popular MP3 and video players depend on a new underfill encapsulant from ICI to help make them more robust. The palm-sized devices allow users to download, store and play music or video files.

Emerson & Cuming (E&C), part of National Starch, a business of ICI, provides XE-1219 underfill encapsulant, which is dispensed onto a circuit board next to an electronic package and flows underneath the package to provide reinforcement to the solder joints that lock the package in place and provide electrical connectivity.

The underfill helps improve the mechanical robustness by protecting the solder joints from stresses, especially important if the player is accidentally dropped.

E&C worked with a leading MP3 manufacturer to deliver a new underfill product in less than six weeks. XE-1219 underfill was created to meet the customer’s specifications for a low viscosity product that could be dispensed at room temperature and also reworked in case the package is poorly placed on the circuit board.

Previously, the underfill needed to be dispensed at elevated temperatures, which added time and equipment cost to the production process. XE-1219 can be dispensed at room temperature, and provides benefits to both customer and the consumer.